Revolutionary 3D DRAM with built-in AI processing could soon replace existing HBM, paving the way for faster and smarter computing.
A new technology, 3D DRAM with integrated AI processing, has the potential to replace current High Bandwidth Memory (HBM). This innovation combines DRAM with AI capabilities, potentially leading to more efficient and powerful memory solutions, which could surpass existing HBM technology. NEO Semiconductor, a company specializing in 3D DRAM and...